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| SKR 16,3 x 18,2 Qu bond Absolute Maximum Ratings Symbol VRRM IF(AV) It IFSM Tjmax 2 Conditions Tj = 25 C, IR = 0.4 mA Tc = 80 C, Tj = 150 C Tj = 150 C, 10 ms, sin 180 10 ms sin 180 Tj = 25 C Tj = 150 C Values 1600 305 130050 6600 5100 150 Unit V A A2s A A C DIODE IF(DC) = 365 A VRRM = 1600 V Size: 16,3 mm x 18,2 mm Electrical Characteristics Symbol IR VF V(TO) rT Conditions Tj = 25 C, VRRM Tj = 120 C, VRRM Tj = 25 C, IF = 320 A Tj = 125 C, IF = 320 A Tj = 125 C Tj = 125 C Tj = 25 C, 1 A min. typ. max. 0.4 2.2 Unit mA mA V V V m s 1 0.9 1.21 1.1 0.83 0.5 SKR 16,3 x 18,2 Qu bond trr 49 Thermal Characteristics Features * high current density due to mesa technology * high surge current * compatible to thick wire bonding * compatible to all standard solder processes Symbol Tj Tstg Tsolder Tsolder Rth(j-c) Conditions min. -40 -40 typ. max. 150 150 250 320 Unit C C C C K/W 10 min. 5 min. Semipack 2 assembly 0.185 Typical Applications * uncontrolled rectifier bridges Mechanical Characteristics Symbol Raster size Area total Anode Cathode Wire bond Package Chips / Package Conditions Values 16,3 x 18,2 296,66 bondable (Al) solderable (Ag/Ni) Al, diameter 500 m tray 20 Unit mm mm2 pcs SKR (c) by SEMIKRON Rev. 0 - 02.10.2009 1 SKR 16,3 x 18,2 Qu bond This technical information specifies semiconductor devices. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. 2 Rev. 0 - 02.10.2009 (c) by SEMIKRON |
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